Catena IP briefs


Please contact us for more detailed datasheets and quotations

2×2 Concurrent dual-band 802.11ax Transceiver IP

The 2×2 MIMO dual-band concurrent IEEE802.11ac/ax transceiver IP is designed for manufacturing in the TSMC 28 nm HPM/HPC process. The transceiver is optimized for high performance applications and its flexibility makes it ideal for proprietary ISM band solutions.

Low Power Multi-Mode Connectivity IP – Bluetooth BT-DM Zigbee radio IP

Low power multi-mode connectivity radio IP compliant with version 5 of the Bluetooth core specification. It supports Bluetooth BR/EDR, LE 1 Mb/s and 2 Mb/s and Bluetooth long range 500 kb/s and 125 kb/s. Additionally, BTDM001T28b2 supports IEEE802.15.4-2015 ZigBee in the 2.45 GHz ISM band. It is a complete radio + modem (PHY) designed for manufacturing in the TSMC 28 nm HPC process.

Low Power Connectivity IP – Bluetooth BLE HCI Controller

Low power connectivity IP compliant with version 5 of the Bluetooth core specification. It supports Bluetooth LE 1 Mb/s and 2 Mb/s and long range 500 kb/s and 125 kb/s. Additionally, BTLE40 supports IEEE802.15.4- 2015 ZigBee in the 2.45 GHz ISM band . It is a complete HCI controller designed for manufacturing in the TSMC 40 nm ULP process.

1×1 non-concurrent dual-band 802.11ac transceiver IP

1×1 concurrent dual-band IEEE802.11ac transceiver IP compliant with the IEEE 802.11a/b/g/n/ac standards. It is a complete front-end optimized for high performance WiFi applications, designed for manufacturing in the TSMC 28nm HPC process.

1×1 concurrent dual-band 802.11ac transceiver IP

1×1 non-concurrent dual-band IEEE802.11ac transceiver IP compliant with the IEEE 802.11a/b/g/n/ac standards. It is a complete front-end optimized for low-cost WiFi applications, designed for manufacturing in the TSMC 28nm HPC process.

2×2 concurrent dual-band 802.11ac transceiver IP

2×2 MIMO dual-band concurrent IEEE802.11ac transceiver IP compliant with the IEEE 802.11a/b/g/n/ac standards. It is a complete front-end optimized for high-performance high-end WiFi applications, designed for manufacturing in the TSMC 28 nm HPC process.